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机译:分子动力学研究纳米高速研磨下单晶铜的表面损伤和材料去除机理
State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha, Hunan Province 410082, PR China,College of Mechanical and Vehicle Engineering, Hunan University, Changsha, Hunan Province 410082, PR China;
State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha, Hunan Province 410082, PR China,College of Mechanical and Vehicle Engineering, Hunan University, Changsha, Hunan Province 410082, PR China;
State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha, Hunan Province 410082, PR China,College of Mechanical and Vehicle Engineering, Hunan University, Changsha, Hunan Province 410082, PR China;
School of Mechanical and Manufacturing Engineering, The University of New South Wales, NSW 2052, Australia;
Nanoscale; High speed grinding; Molecular dynamics; Subsurface damage; Deformation mechanism;
机译:使用分子动力学研究的Ni / Cu多层高速研磨过程中的地下损伤和材料去除机制
机译:镍/铜多层高速磨削过程中亚表面损伤和材料去除的机理的分子动力学研究
机译:使用分子动力学(MD)模拟在高速磨削下的Al-Si双层亚表面损伤和材料去除
机译:缺陷单晶铜的纳米尺度接触过程的分子动力学研究
机译:分子动力学研究单晶和纳米晶铜中空穴的引发和生长。
机译:单晶铜的基于切削的单原子层去除机理:边缘半径效应
机译:使用分子动力学研究的Ni / Cu多层高速研磨过程中的地下损伤和材料去除机制
机译:光学材料的亚表面损伤:起源,测量和去除:总结。