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Method and apparatus for removal of subsurface damage in semiconductor materials by plasma etching
Method and apparatus for removal of subsurface damage in semiconductor materials by plasma etching
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机译:通过等离子体蚀刻去除半导体材料中的表面下损伤的方法和设备
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摘要
A high pressure plasma is used in conjunction with a plasma assisted chemical etching material removal tool 10 to rapidly remove subsurface damage from a substrate without mechanically contacting the surface and without introducing new microscopic or atomic damage to the substrate. IMAGE
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