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Special Atricles: The Micro Soldering Technology of Super High Density Packaging. The Mechanism of Migration Phenomenon for Fine Pitch Packaging.

机译：特殊阿里克莱：超高密度包装的微焊接技术。细间距包装的迁移现象机理。

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Yoshinobu ANBE;
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年度 1994
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1. Migration phenomenon in food packaging. food-package interactions, mechanisms, types of migrants, testing and relative legislation-a review. [J] . Arvanitoyannis I. S., Kotsanopoulos K. V. Food and bioprocess technology . 2014,第1期

机译：食品包装中的迁移现象。食品包装的相互作用，机制，移民类型，检测和相关立法-综述。
2. Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects [J] . Yu A., Lau J. H., Ho S. W., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第9期

机译：高长宽比TSV的制造以及用于具有高密度互连的Si中介层技术的细间距低成本焊锡微凸块的组装
3. New approach to study the mechanism of antimicrobial protection of an active packaging. [J] . Gutierrez L, Batlle R, Sanchez C, Foodborne pathogens and disease . 2010,第9期

机译：研究活性包装抗菌保护机制的新方法。
4. Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch [C] . Jae-Woong Nah, Li-Wen Hung, Paul Andry, IEEE Electronic Components and Technology Conference . 2018

机译：注入熔融焊料（IMS）技术可在晶圆，陶瓷/有机/柔性基板和Si上通过从小间距到大间距的填充填充焊料
5. A systems approach to ultra-fine pitch flip chip interconnect packaging. [D] . Nagarkar, Kaustubh Ravindra. 2005

机译：一种超细间距倒装芯片互连封装的系统方法。
6. Special Articles: The Micro Soldering Technology of Super High Density Packaging. Soldering Technology of Fine Pitch Packages. [O] . Haruo MISHINA 1994

机译：特殊用品：超高密度包装的微焊接技术。精细间距包装的焊接技术。
7. Special Technology Area Review on Electronics Packaging. [R] . 1993

机译：电子封装专业技术领域回顾。

Special Atricles: The Micro Soldering Technology of Super High Density Packaging. The Mechanism of Migration Phenomenon for Fine Pitch Packaging.

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