Adhesion of Diamond Films on Tungsten

摘要

Diamond films were deposited on tungsten substrates and the effects of depositionparameters on adhesion were determined. The films were produced using a hot filament chemical vapor deposition system. Parameters investigated were substrate temperature and methane concentration in the feed gas. Film quality, morphology, and composition were characterized by scanning electron microscopy, and Raman spectroscopy. Adhesion testing were performed using an indentation technique and the results were quantified by relating adhesion to interface fracture toughness. Diamond films with well-faceted crystalline morphology with grain size greater then 1 micrometers had poor adhesion properties regardless of substrate temperature or methane concentration.