Correlations of the growth, structure and stress with the adhesion of diamond films on tungsten.

摘要

Diamond films were deposited on tungsten substrates by a filament-assisted chemical vapor deposition process as a function of seven different processing parameters. The effect of variations in measured film characteristics such as growth rate, texture, diamond-to-nondiamond carbon Raman band intensity ratio and strain on the adhesion between the diamond film/tungsten substrate pairs as measured by a tensile pull method were investigated. The measured adhesion values do not correlate with any of the measured film characteristics mentioned above. The problem arises because of the non-reproducibility of the adhesion test results, due to the non-uniformity of film thickness, surface preparation and structural homogeneity across the full area of the substrate.