Nature and Growth Kinetics of the Diffusion Layer of Copper Joints Soldered by Tin-Lead Solders

摘要

Copper is joined by tin and Pb-Sn solders under a variety of experimental variables. The soldered joints are then examined in the optical microscope and with an electron probe microanalyzer. Microhardness traverses are made in the diffusion zone. Phases are determined and their growth kinetics recorded. The soldered joints are pulled apart in a mechanical test of their strength.