单晶铜／多晶铜闪光对焊接头组织的演变

摘要

电阻焊在焊接单晶铜/多晶铜时，可使焊接热过程对单晶组织影响最小化。采用不同焊接电流，对单晶铜/多晶铜进行闪光对焊，对焊接接头的热影响区宽度和显微组织进行了分析。结果表明：闪光对焊对多晶铜组织的影响极为显著，随着离焊缝距离的增加，依次呈现出粗晶区、细晶区、超细晶区、超细晶与母材混合区。单晶铜一端仅在近缝处的极小范围内发生了再结晶行为。%When single crystal copper and poly-crystal copper (PCC ) were welded by resistance welding ,the effect on single crystal copper(SCC) is very small .For SCC and PCC by flash butt welding with different welding currents ,the width of heat affected zone and microstructures of welded joint were investigated .The results showed that flash butt welding made significant changes in the microstructure of PCC .Coarse grain area ,fine grain area ,super fine grain area ,super fine crystal mixed with the base metal zone can be observed with increase of the distance from the welding seam .However , recrystallization happened just in tiny range nearby the welding seam for single crystal copper .