铜热浸镀铝扩散层生长动力学模型∗

摘要

Copper were hot-dipped aluminum through one-bath,the hot-dip time was 10-25 s,the hot-dip tem-perature was 963-1 013 K.The effects of hot-dip temperature and time on the diffusion layer thickness of the Cu/Al composite were studied.Cu/Al composites interfacial diffusion layer growth kinetics model,based on hot-dip aluminum test,was established.The results showed that The growth kinetics of the interfacial diffusion layer of Cu/Al composite is in accordance with the parabolic diffusion and the interfacial diffusion layer thickness of Cu/Al composite is proportional to the index of hot-dip coating temperature and has a parabolic growth relationship with the hot-dipping time;the correction coefficient k of growth kinetics model of diffusion layer of copper hot-dipping aluminum has a linear relationship with time.%采用一浴法对铜进行了热浸镀铝试验,热浸镀时间为10~25 s,热浸镀温度为963~1013 K.研究了热浸镀温度和时间对铜铝复合材料界面扩散层厚度的影响,采用XPL-15型偏光显微镜(PM)测量铜铝复合材料扩散层厚度,并依据热浸镀铝试验建立了铜铝复合材料界面扩散层生长动力学模型.结果表明,铜铝复合材料界面扩散层的生长动力学符合抛物线扩散规律,与热浸镀温度的指数成正比,与热浸镀时间成抛物线增长关系；铜热浸镀铝扩散层生长动力学模型的修正系数k 与时间t 存在线性关系.