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EVALUATION OF CRITICAL PROPERTIES OF SELECTED MATERIALS FOR ELECTRONIC PACKAGING PURPOSES

机译：电子封装用选材料临界性能的评价

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Adhesives, protective coatings, potting compounds for electronic packaging

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作者
De Dapper, J. W.;
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年度 1962
页码 1-14
总页数 14
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
ADHESIVES; ELECTRONIC PACKAGING; POTTING COMPOUNDS; PROTECTIVE COATINGS; ADHESIVE; ELECTRONIC PACKAGING; POTTING COMPOUND; PROTECTIVE COATING;

机译：粘合剂;电子包装;打击化合物;防护涂料;胶粘剂;电子包装; pOTTING COmpOUND;保护涂层;

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8. EVALUATION OF CRITICAL PROPERTIES OF SELECTED MATERIALS FOR ELECTRONIC PACKAGING PURPOSES [R] . De Dapper, J. W. 1962

机译：电子封装用选材料临界性能的评价

EVALUATION OF CRITICAL PROPERTIES OF SELECTED MATERIALS FOR ELECTRONIC PACKAGING PURPOSES

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