首页> 美国政府科技报告 >High Resolution Non-Contact Thermal Characterization Semiconductor Devices
【24h】

High Resolution Non-Contact Thermal Characterization Semiconductor Devices

机译:高分辨率非接触式热特性半导体器件

获取原文

摘要

Non-contact optical methods can be used for sub micron surface thermal characterization of active semiconductor devices. Point measurements were first made, and then real time thermal images were acquired with a specialized PINarray detector. This method of thermal imaging can have spatial resolution better than the diffraction limit of an infrared camera and can work in a wide range of ambient temperatures. The experimentally obtained thermal resolution is on the order of 50mK.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号