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III-V compound semiconductor material characterization of microstructures and nanostructures on various optoelectronic devices with analytical transmission electron microscopy and high resolution electron microscopy .

机译:III-V型化合物半导体材料表征的各种光电子器件的微结构和纳米结构的分析透射电子显微镜和高分辨率电子显微镜。

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摘要

Analytical Transmission Electron Microscopy (TEM) and High Resolution Electron Microscopy have been carried out to characterize microstructures and nanostructures in various III-V compound semiconductor devices by metalorganic chemical vapor deposition (MOCVD).; The low-defect GaN nonplanar templates by lateral epitaxial overgrowth (LEO) has a trapezoidal cross-section with smooth (0001) and {lcub}112¯2{rcub} facets. Penetration of threading dislocations (TDs) beyond mask windows is observed in ordinary LEO substrates. In two-step LEO substrates, where TDs are engineered to bend 90° in the TD bending layer after the first LEO step, only perfect a-type dislocations with Burgers vector b = 1/3 ⟨112¯0⟩ are generated in the upper Post-bending layer with a density of ∼8 x 107cm-2. The demonstrated 3-dimensional dislocation spatial distribution in the LEO nonplanar substrate substantiates the dislocation reaction mechanism. Al0.07GaN/GaN superlattice can further decrease dislocations. InGaN QW thickness enhancement on top of GaN nonplanar templates has been verified to influence the optoelectronic properties significantly.; Dense arrays of hexagonally ordered MOCVD-grown (In)(Ga)As nano-QDs by block copolymer nanolithography & selective area growth (SAG), approximately 20nm in diameter and 40nm apart with a density of 1011/cm 2, are perfect crystals by TEM. V-shaped defects and worse InAs growth uniformity have been observed in multiple layers of vertically coupled self-assembled InAs nanostructure arrays on strain-modulated GaAs substrates. TEM shows a smooth coalesced GaN surface with a thickness as thin as ∼200nm after Nano-LEO and a defect reduction of 70%--75%.; The (In)GaAs 20 nm twist bonded compliant substrates have almost no compliant effect and higher dislocation density, but the 10nm compliant substrates are on the contrary.; A 60nm oxygen-infiltrated crystallized transition layer is observed between the amorphous oxidized layer and the crystallized unoxidized aperture in Al xGa1-xAs wet lateral oxidation, potentially influencing the current confinement characteristic of the sub-micron oxide aperture. Almost no dislocation is aroused by the wet lateral oxidation of In0.52Al 0.48As in the InP microresonator waveguides.; XTEM was performed to compare InP SAG regions with 10∼50mum masks, which shows the performance deterioration of laser threshold current densities in the case of 50mum mask results from high density of dislocations induced from the highly strained QW structures caused by the high enhancements.
机译:已经通过金属有机化学气相沉积(MOCVD)进行了透射电子显微镜(TEM)和高分辨率电子显微镜以表征各种III-V族化合物半导体器件中的微结构和纳米结构。通过横向外延过度生长(LEO)制成的低缺陷GaN非平面模板的梯形截面具有光滑(0001)和{lcub} 112 2 {rcub}的小平面。在普通的LEO基板中观察到了超出掩模窗口的螺纹位错(TDs)的渗透。在两步式LEO基板中,在第一步LEO之后,将TD设计为在TD弯曲层中弯曲90°,在上部仅产生Burgers向量b = 1/3 〈112′0〉的完美a型位错。后弯曲层的密度约为8 x 107cm-2。 LEO非平面基底中的3维位错空间分布证实了位错反应机理。 Al0.07GaN / GaN超晶格可以进一步减少位错。已经验证了GaN非平面模板顶部的InGaN QW厚度增强可以显着影响光电性能。通过嵌段共聚物纳米光刻和选择性区域生长(SAG)形成的六方有序MOCVD生长的(In)(Ga)As纳米QD密集阵列,直径约20nm,相距40nm,密度为1011 / cm 2,是完美的晶体。透射电镜在应变调制的GaAs衬底上的多层垂直耦合自组装InAs纳米结构阵列中,已观察到V形缺陷和较差的InAs生长均匀性。 TEM显示出光滑的聚结的GaN表面,纳米LEO后的厚度薄至约200nm,缺陷减少了70%-75%。 (In)GaAs 20nm扭曲键合的柔性衬底几乎没有柔性效果和较高的位错密度,但是10nm柔性衬底却相反。在Al xGa1-xAs湿法横向氧化过程中,在非晶氧化层和结晶未氧化孔之间观察到60nm的氧渗透结晶过渡层,可能影响亚微米氧化物孔的电流限制特性。在InP微谐振器波导中,In0.52Al 0.48As的湿法横向氧化几乎不会引起位错。 XTEM用来比较InP SAG区域与10到50μm的掩模,这表明在50μm掩模的情况下,激光阈值电流密度的性能下降是由于高增强引起的高应变QW结构引起的高位错密度导致的。

著录项

  • 作者

    Zhou, Wei.;

  • 作者单位

    University of Southern California.;

  • 授予单位 University of Southern California.;
  • 学科 Engineering Materials Science.; Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2004
  • 页码 193 p.
  • 总页数 193
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;无线电电子学、电信技术;
  • 关键词

  • 入库时间 2022-08-17 11:44:21

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