Production Engineering Measure Reliability Through Process Improvement (Extension to 2n2525 Transistor Family)

摘要

Investigation of the silicon die attachment using x-rays, step stress and cross-sectioning showed that under standard mounting conditions reliable mounts could be easily produced. Package design was finalized, based on the analytical studies given in the previous quarterly report and experiments performed in this quarter. Use of the flange and package cap as a hot emitter terminal showed no enhancement in the RF response of the package. This aspect of the package design has been dropped. The final conclusion of the investigation into high strength, reproducible ceramic metallizing mixtures was that the standard moly-manganese gave the most reliable results. Pure silver was the final selection for the pin braze material. (Author)