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Electrical Performance and Reliability Improvement of Amorphous-Indium-Gallium-Zinc-Oxide Thin-Film Transistors with HfO2 Gate Dielectrics by CF4 Plasma Treatment

机译:CF4等离子体处理HfO2栅电介质的非晶铟镓锌氧化物薄膜晶体管的电性能和可靠性提高

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摘要

In this work, amorphous indium-gallium-zinc oxide thin-film transistors (a-IGZO TFTs) with a HfO2 gate insulator and CF4 plasma treatment was demonstrated for the first time. Through the plasma treatment, both the electrical performance and reliability of the a-IGZO TFT with HfO2 gate dielectric were improved. The carrier mobility significantly increased by 80.8%, from 30.2 cm2/V∙s (without treatment) to 54.6 cm2/V∙s (with CF4 plasma treatment), which is due to the incorporated fluorine not only providing an extra electron to the IGZO, but also passivating the interface trap density. In addition, the reliability of the a-IGZO TFT with HfO2 gate dielectric has also been improved by the CF4 plasma treatment. By applying the CF4 plasma treatment to the a-IGZO TFT, the hysteresis effect of the device has been improved and the device’s immunity against moisture from the ambient atmosphere has been enhanced. It is believed that the CF4 plasma treatment not only significantly improves the electrical performance of a-IGZO TFT with HfO2 gate dielectric, but also enhances the device’s reliability.
机译:在这项工作中,首次展示了具有HfO2栅极绝缘体和CF4等离子体处理的非晶铟镓锌氧化物薄膜晶体管(a-IGZO TFT)。通过等离子体处理,具有HfO2栅极电介质的a-IGZO TFT的电性能和可靠性均得到改善。载流子迁移率显着提高了80.8%,从30.2 cm 2 / V∙s(未经处理)提高到54.6 cm 2 / V∙s(经过CF4等离子体处理),这是由于掺入的氟不仅为IGZO提供了额外的电子,而且钝化了界面陷阱密度。此外,通过CF4等离子体处理,具有HfO2栅极电介质的a-IGZO TFT的可靠性也得到了提高。通过将CF4等离子体处理应用于a-IGZO TFT,该器件的磁滞效应得到改善,并且该器件对来自周围大气的水分的抵抗力得到增强。相信CF4等离子体处理不仅可以显着改善具有HfO2栅极电介质的a-IGZO TFT的电气性能,而且可以提高设备的可靠性。

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