Integrated Circuit Reliability and Manufacturing Science (ICRMS) - A Technical Overview.

摘要

The present state-of-the-art in IC manufacturing is described in terms of electrical and physical limitations. The critical limitations of present IC manufacturing techniques and promising advanced fabrication techniques for overcoming these limitations are described for basic IC process areas. These process areas include wafer cleaning and handling, patterning, dielectric film formation, doping, metalization, bonding, assembly, packaging, diagnostics, prognostics, automation and control. In each of these areas, the potential benefits which could be realized by the Navy through the development of advanced manufacturing techniques are forecast in terms of future IC reliability, cost, complexity, and performance.