Multicomponent E-Beam Resists Containing Organometallic Compounds and Reactive Monomers

摘要

Negative working resists with combined e beam sensitivity and oxygen etch resistance have been formulated by combining a host polymer for dimensional stability during radiation processing, an unsaturated, non-volatile monomeric component for control of sensitivity, and, an organometallic compound to contribute (Reaction ion etching) RIE resistance in an oxygen plasma. We have incorporated these three components into blends by three methods. Microlithography, Electron beam resist, Organometallic compounds, Reactive ion etching. (MJM)