Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies

摘要

This Task 3 Technical Operating Report is comprised of three basic sections. Thefirst section is an overall description of the Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies (PWAs) Program. Included is a description of the PWA design, continuous process improvement, and the seven basic experimental approach. The second section presents the results obtained by performing the statistically designed experiments described in the second technical report for this Electronic Manufacturing Process Improvement Program, 'Program Task 2 Project Description Report' dated February 1991. The second section also presents the analyses performed on those results, and identifies the process capability indices (Cp and Cpk) for the seven processes evaluated. It includes a discussion and conclusion of the analyses, and process capability indices determined from the experimental data. It describes the final, statistically designed experiment that is being run as the wrap-up to this phase of the EMPI for PWAs Program. This experiment will be run to demonstrate and quantity the process improvements achieved as a result of applying design of experiments (DOE) methodology to TRW-MEAD's surface mount printed wiring assembly operation. The third section is the Appendices which contain the Cost Benefits Analysis for this program and the finalized detailed experimental plans for the seven experiments run under Task 3 of this program. Printed Wiring Assemblies (PWAs), Electronic Manufacturing Process Improvement (EMPI), Design of Experiments (DOE), Printed Wiring Board (PWB), Solder Joint, Tinning, Fine Pitch Device (FPD).