Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies. Program Task 3: Experimental Results. Volume 2. Appendices.

摘要

The equipment used in these capability studies is new and therefore there is no actual data, available that could be used for base-line costing. The intra studies were performed when the equipment was first made operational and only a small amount of production has been performed on the equipment. The cost model developed for the PWA EMPI program is based on using Cp and Cpk to develop first pass process yields and then converting these into processing costs and cycle times. Scrap cost have been estimated at rates traditional for the type of equipment and processes used, because there is no actual data available for this PWA line. The equipment and process cycle times are based on simulation data used in the design of the facility. The baseline costs where developed using Cps and Cpks developed in the intra studies. These will than be compared to the costs developed from the Cps and Cpks generated based on the inter studies. Also included in this report are yield and cycle time goals that have been developed by calculating what a 100% first pass yield produced potential overall cost saving possible and measuring that against the intra baseline to derive the inter goals. Printed Wiring Assemblies (PWAs), Electronic Manufacturing Process Improvement (EMPI), Design of Experiments (DOE), Printed Wiring Board (PWB), Solder Joint, Tinning, Fine Pitch Device (FPD) Final Run, Cost Savings.