Nanostructure Engineering Using Electron Beam Lithography

摘要

This Ph.D. thesis addresses nanostructure fabrication techniques based on electron beam lithography and their application to: the creation of ultra-fast metal-semiconductor-metal photodetectors and quantum effect transistors, the investigation of light emission from silicon, and the enhancement of resolution in magnetic force microscopy. Specifically, this thesis covers the following topics. (1) The implementation and characterization of an ultra-high resolution electron beam lithography (EBL) system created by modifying a scanning electron microscope. (2) The exploration of minimum achievable feature sizes using ultra-high resolution EBL and a lift-off process with polymethyl-methacrylate resists. 10 nm features, which are among the smallest ever achieved using EBL, have been obtained using a double shadow evaporation technique, a ultra-high resolution EBL technique, and a technique utilizing EBL, reactive ion etching, and subsequent wet etching. (3) The application of ultra-high resolution EBL technology to the fabrication of ultra- fast metal-semiconductor-metal (MSM) photodetectors. The fastest response time reported to date has been achieved in this project. (4) The fabrication and characterization of modulation doped field effect transistors. Quantum effects have been observed in a point contact device. (5) The fabrication of sub-50 nm Si structures using EBL, reactive ion etching (RIE) and subsequent wet etching for the study of photoluminescence (PL) from Si. PL has been observed from an array of 20 nm diameter pillars. And finally, (6) the application of high resolution EBL to the study of magnetic materials. Single domain magnetic particles and novel MFM tips have been fabricated.