Finite Element Mesh Generation and Analysis of Solder Joints for Fatigue LifePredictions

摘要

Tools for fatigue life prediction of solder joints are developed. This reportconsists of two parts. In Part One, the creep and plastic deformations stored in a solder joint are calculated by implementing appropriate plastic and creep constitutive models in a nonlinear finite element program. The calculated damage in each cycle is then related to the life of the material using two failure criteria: strain-life and energy-partitioning. The importance of parameters affecting the fatigue life of solders are evaluated. In Part Two, the finite element analysis is combined with x-ray and laser imaging systems, from which real solder joint geometries can be constructed. The approaches presented herein provide a useful tool in the design and manufacturing of surface-mount assemblies. Solder, Solder joint, Fatigue life, Creep, Thermal stress, Finite element analysis, Mesh generation.