Liquid Metal Cluster Ion Source Technology for Repair of Packaging Interconnects

摘要

In this report we summarize the results of the program for writing metal features using liquid metal cluster ion source (LMCIS). We have developed a suitable source and extractor geometry for obtaining metal deposition due to charged clusters and microdroplets. The experiments were carried out using gold and lead/tin solder sources. We have carried out experiments and have characterized the quality of deposited metal/alloy films. We have evaluated throughput, spot size and shape, film adhesion to various substrates and film morphology. Experiments were also carried out to focus the charged cluster beam. Based on these results, it is feasible to apply this technology to address the problems of multi chip module integration. There have been essentially three different designs of LMCIS that are investigated to date. These sources are: Capillary or nozzle type, needle-nozzle type and needle type. A needle type source was investigated in the present study and found to produce axially symmetric distributions of cluster ions.