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首页> 外文期刊>International Journal of Abrasive Technology >Study on the ductile mode cutting of LiNbO_3 wafer for fabrication of SAW device
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Study on the ductile mode cutting of LiNbO_3 wafer for fabrication of SAW device

机译:用于制造声表面波器件的LiNbO_3晶片的延性模切割研究

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This paper describes the cutting characteristics of lithium niobate, which is used for surface acoustic wave type micro pumps, regarding the formation of micro grooves by direct cutting. Since lithium niobate is a brittle material with a strong crystal orientation dependency, significant differences were observed in the characteristics of the finished surface according to different directions of cutting. The ductile mode cutting of lithium niobate was found to be feasible with cutting depths of approximately 5 μm or less. Also, results of the study show the feasibility of the formation of minute grooves through the cutting of lithium niobate, using milling with an end mill.
机译:本文介绍了用于声表面波型微泵的铌酸锂的切削特性,该特性涉及通过直接切削形成微沟槽。由于铌酸锂是一种脆性材料,具有很强的晶体取向依赖性,因此根据不同的切割方向,观察到精加工表面的特性存在明显差异。发现以约5μm或更小的切削深度进行铌酸锂的延展模式切削是可行的。而且,研究结果表明,通过用立铣刀进行铣削,可以通过切割铌酸锂形成微小的凹槽。

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