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Wafer Fusion: A Novel Technique for Optoelectronic Device Fabrication andMonolithic Integration

机译：晶圆融合：一种用于光电器件制造和单片集成的新技术

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Centimeter-size single-crystal InP or Gallium Arsenide wafers have been togetherentirely, face to face or side by side, after a heat treatment in a graphite/quartz reactor which can press the wafers together through differential

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作者
Liau, Z. L.; Mull, D. E.;
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年度 1990
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总页数 4
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Electric current; Electrooptics; Emission; Fabrication; Gallium arsenides; Heattreatment; Light; N type semiconductors; Sides; Thermal expansion; Voltage; Wafers; Reprints;

机译：电流;电光学;发射;制造;砷化镓;热处理;光; N型半导体;侧面;热膨胀;电压;晶片;重印;

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专利

1. Fabrication of GaN wafers for electronic and optoelectronic devices [J] . Xueping Xu, R.P. Vaudo, G.R. Brandes Optical Materials . 2003,第1a2期

机译：用于电子和光电器件的GaN晶片的制造
2. Wafer-Scale Integration of Graphene-based Electronic, Optoelectronic and Electroacoustic Devices [J] . He Tian, Yi Yang, Dan Xie, Scientific reports. . 2014,第1期

机译：基于石墨烯的电子，光电和电声器件的晶圆级集成
3. Wafer-Scale Integration of Graphene-based Electronic, Optoelectronic and Electroacoustic Devices [J] . He Tian, Yi Yang, Dan Xie, Scientific reports. . 2014,第1期

机译：基于石墨烯的电子，光电和电声器件的晶圆级集成
4. Fabrication of wafer level chip scale packaging for optoelectronic devices [C] . Jim, K.L., Faulkner, Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th . 1999

机译：光电器件晶圆级芯片级封装的制造
5. Polymer electro-optic waveguide devices: Low-loss etchless fabrication techniques and passive-to-active integration. [D] . Geary, Kevin. 2006

机译：聚合物电光波导器件：低损耗无蚀刻制造技术和无源到有源集成。
6. Wafer-Scale Integration of Graphene-based Electronic Optoelectronic and Electroacoustic Devices [O] . He Tian, Yi Yang, Dan Xie, -1

机译：基于石墨烯的电子光电和电声器件的晶圆级集成
7. Wafer-Scale Integration of Graphene-based Electronic, Optoelectronic and Electroacoustic Devices [O] . He Tian, Yi Yang, Dan Xie, 2014

机译：基于石墨烯的电子，光电子和电声装置的晶圆级集成

Wafer Fusion: A Novel Technique for Optoelectronic Device Fabrication andMonolithic Integration

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