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Solution of the problem of charge-carrier injection into an insulating layer under self-consistent boundary conditions at contacts

机译:解决接触点自洽边界条件下将载流子注入绝缘层的问题

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The problem of charge carrier injection into a finite-length insulating layer is analytically solved in the drift-diffusion approximation, taking into account self-consistent boundary conditions. The main assumption is the neglect of intrinsic doping of the i-type layer. The solution allows calculation of the potential, electric field, and current-voltage characteristics of various structures, i.e., metal-i-n (+) (or p (+))-semiconductor, metal-i-layer-metal, and n (+)(p (+))-i-n (+)(p (+)) structures. The solution allows generalization for structures having heterobarriers at semiconductor layer interfaces. The proposed approach considers contact phenomena and volume effects associated with the space-charge-limited current in the i-type layer. The solution is valid in both extreme cases and intermediate conditions.
机译:考虑到自洽边界条件,可以通过漂移扩散近似分析来解决将电荷载流子注入有限长度绝缘层的问题。主要假设是忽略了i型层的固有掺杂。该解决方案可以计算各种结构的电势,电场和电流-电压特性,即金属化(+)(或p(+))半导体,金属i层金属和n(+ )(p(+))-in(+)(p(+))结构。该解决方案允许对在半导体层界面处具有异质势垒的结构进行一般化。所提出的方法考虑了与i型层中空间电荷限制电流相关的接触现象和体积效应。该解决方案在极端情况和中间条件下均有效。

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