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Investigation of dealloying in Au-Ag thin films by quantitative electron probe microanalysis

机译:定量电子探针显微分析法研究Au-Ag薄膜中的脱合金

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Dealloying of Au-Ag films has been investigated by quantitative electron probe microanalysis and scanning electron microscopy. For film compositions greater than 44 at. percent Au, dissolution of Ag is limited, with individual pores distributed randomly on the surface. Dealloying is enhanced as the initial Au content decreases below 44 at. percent. The Dealloying threshold, or parting limit, below which the fully nanoporous structure evolves, is 35 at. percent Au. Dealloying also causes a slight decrease in film thickness, which is readily measured using the technique discussed here.
机译:已经通过定量电子探针显微分析和扫描电子显微镜研究了Au-Ag膜的脱合金。对于大于44at。%的膜组成。在Au含量不超过100%的情况下,Ag的溶解受到限制,各个孔随机分布在表面。随着初始Au含量降低到44 at以下,脱合金能力得到增强。百分。脱发阈值或分离极限为35 at at,低于该极限时,将形成纳米多孔结构。金百分比脱合金还会导致薄膜厚度略微降低,这很容易使用此处讨论的技术进行测量。

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