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Silicon microphotonics for fast integrated circuit connections

机译:硅微光子学,用于快速集成电路连接

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Electrical connections inside VLSI chip will become one of the bottlenecks for the increase in performances. This is due to the shrinking of lateral dimensions of electrical links concomitant to operation frequency rise. Optical distribution of data on global links may improve the synchronism of the delivery while reducing the required power, as well as freeing the routings on the higher metallic layers (data clock delivery for instance) An optical connecting system is architectured using basic blocks operating in the near infrared. Integrated light emitters are coupled to silicon optical wave guides which constitutes an optical distribution. At the end of these waveguides, photodetectors transform the optical function results in electrical signals which are processed by the underlying integrated circuit.
机译:VLSI芯片内部的电气连接将成为性能提升的瓶颈之一。这是由于伴随工作频率升高的电连接的横向尺寸缩小。全局链路上数据的光学分布可以改善传输的同步性,同时减少所需的功率,并释放较高金属层上的路由(例如,数据时钟传输)。近红外。集成的光发射器耦合到构成光分布的硅光波导。在这些波导的末端,光电检测器转换光学功能,从而产生电信号,该电信号由底层集成电路处理。

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