Influences of Nano-Scale Packaging Induced Residual Strain on Performances of RF MEMS Devices

摘要

A multiphysics finite element analysis (FEA) was performed to investigate the influences of nanoscale packaging induced residual strain on the performances of RF MEMS devices. A packaged surface acoustic wave (SAW) resonator was taken as a research example. Results show that the packaging process will induce an uneven distribution of deformation in the surface layer of the chip substrate. The difference between maximum and minimum displacements linearly increases with the packaging pressure. This uneven surface deformation will affect the propagation of the surface acoustic wave and the RF characteristics of the device. Both resonance and anti-resonance frequencies of the resonator shift.