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首页> 外文期刊>Nanoscience and Nanotechnology Letters >Effects of Gate/Blocking Oxide Energy Barrier on Memory Characteristics in Charge Trap Flash Memory Cells
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Effects of Gate/Blocking Oxide Energy Barrier on Memory Characteristics in Charge Trap Flash Memory Cells

机译:栅/阻挡氧化物能垒对电荷陷阱闪存单元存储特性的影响

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A charge trap flash (CTF) memory cell consists of oxide-nitride-oxide multilayer dielectrics and the electron/hole trapping within the silicon nitride layer is the main charge storage mechanism for program/erase operation. However, CTF memory cells have some technical issues, such as the electron back-tunneling phenomenon which causes the non-fully erased state and makes its memory window narrow and memory speed slow during erase operation. In this paper, we focus on the effects of the blocking oxide energy barrier from the control gate on the memory characteristics in CTF memory cells. Our experimental results show that a relatively high gate/blocking oxide energy barrier leads to a reduced non-fully erased state problem but a smaller program threshold voltage shift; conversely, a relatively low gate/blocking oxide energy barrier leads to a larger program threshold voltage shift but a significant non-fully erased state problem. All of these results will contribute to understand the trade-offs between the gate/blocking oxide energy barrier and memory window for optimizing CTF memory cell performance.
机译:电荷陷阱闪存(CTF)存储器单元由氧化物-氮化物-氧化物多层电介质组成,氮化硅层内的电子/空穴陷阱是编程/擦除操作的主要电荷存储机制。然而,CTF存储单元具有一些技术问题,例如电子反向隧穿现象,其导致非完全擦除状态,并且使其擦除操作期间的存储窗口变窄并且存储速度变慢。在本文中,我们集中于控制栅的阻挡氧化物能垒对CTF存储单元中存储特性的影响。我们的实验结果表明,较高的栅极/阻挡氧化物能垒导致减少的未完全擦除状态问题,但编程阈值电压偏移较小;相反,较低的栅极/阻挡氧化物能垒会导致较大的编程阈值电压偏移,但会导致严重的未完全擦除状态问题。所有这些结果将有助于理解栅极/阻挡氧化物能垒和存储器窗口之间的权衡,以优化CTF存储器单元的性能。

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