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Characterization of capacitive micromachined ultrasonic transducers

机译:电容式微加工超声换能器的表征

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This paper describes numerical and experimental characterization of capacitive micromachined ultrasonic transducers (CMUTs) for ultrasound transmission. Simulations based on a finite elements method to model the electromechanical behaviour of CMUTs and to determine the dimensions of elementary cells are presented. In particular, we analyse how the collapse voltage and the capacitance are affected by different parameters of a circular cell and by different bias voltages. The fill factor is defined as the ratio of the top electrode radius to the membrane radius and we study the influence of the fill factor in the performances of CMUTs. The fabrication process of a CMUT uses anodic bonding of a SOI wafer on a borosilicate glass substrate and we compare experimental results with numerical results in terms of eigenfrequencies, bandwidth, quality factor and capacitance for non-metallized and metallized membranes.
机译:本文介绍了用于超声传输的电容式微加工超声换能器(CMUT)的数值和实验特性。提出了基于有限元方法的仿真,以对CMUT的机电行为建模并确定基本单元的尺寸。特别是,我们分析了崩溃电压和电容如何受圆形电池的不同参数和不同的偏置电压影响。填充因子定义为顶部电极半径与膜片半径之比,我们研究填充因子对CMUT性能的影响。 CMUT的制造过程在硼硅酸盐玻璃基板上使用SOI晶片的阳极键合,我们将实验结果与数值结果进行了比较,包括非金属化膜和金属化膜的本征频率,带宽,品质因数和电容。

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