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Electrical characteristics of electroless gold contacts on p-type Hg_(1-x)Cd_xTe

机译:p型Hg_(1-x)Cd_xTe上化学镀金触点的电气特性

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High contact resistance of the order of 10~(-3) Ω cm~2 observed in p-type HgCdTe is one of the practical problems in the production of fine pitch high operating temperature and avalanche photodiode detector array. Electrical and compositional measurements on Au/p-HgCdTe are reported to understand the difficulties in reducing the contact resistance in HgCdTe detectors. Characterization of Au contacts on p-type Hg_(1-x)Cd_xTe (x=0.3) formed by electrode-less (electroless) process and current transport mechanism are discussed. SIMS depth profiling of interfacial layer formed by the reaction of gold chloride with HgCdTe have been analyzed. Extent of the interfacial layer containing Au, Te, O and Cl is found to increase with increasing deposition time. Effect of annealing on the migration of Au across the contact region and electrical characteristics are presented. Heavily doped HgCdTe region with N_A=10~(17) cm~(-3) is produced beneath the contact regions after annealing at 80 ℃ leading to an order of magnitude improvement in the specific contact resistance. These results are useful for the creation of Au/p-HgCdTe contacts in a controlled and reproducible manner.
机译:在p型HgCdTe中观察到的约10〜(-3)Ωcm〜2的高接触电阻是生产细间距高工作温度和雪崩光电二极管探测器阵列时的实际问题之一。据报道,在Au / p-HgCdTe上进行了电学和成分测量,以了解降低HgCdTe检测器接触电阻的困难。讨论了通过无电极工艺和电流传输机制在p型Hg_(1-x)Cd_xTe(x = 0.3)上形成Au触点的特性。分析了氯化金与HgCdTe反应形成的界面层的SIMS深度分布。发现包含Au,Te,O和Cl的界面层的程度随沉积时间的增加而增加。提出了退火对金在整个接触区域的迁移和电特性的影响。 80℃退火后,在接触区下方产生了N_A = 10〜(17)cm〜(-3)的重掺杂HgCdTe区,比电阻提高了一个数量级。这些结果对于以可控和可重现的方式创建Au / p-HgCdTe触点很有用。

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