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首页> 外文期刊>Materials science in semiconductor processing >Strain analysis of the GaN epitaxial layers grown on nitridated Si(111) substrate by metal organic chemical vapor deposition
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Strain analysis of the GaN epitaxial layers grown on nitridated Si(111) substrate by metal organic chemical vapor deposition

机译:金属有机化学气相沉积法在氮化Si(111)衬底上生长的GaN外延层的应变分析

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摘要

The strain analysis of GaN film on nitridated Si(111) substrate with different growth times between 0 and 660 s via metal organic chemical vapor deposition (MOCVD) was conducted based on the precise measurement of the lattice parameters by using high-resolution X-ray diffraction (HR-XRD). The nitridation time (NT) was changed at a fixed growth condition. The a- and c-lattice parameters were measured, followed by the in-plane and out-of-plane strains. Then, the biaxial and hydrostatic components were extracted from the total strain values obtained, and were then discussed in the present study as functions of the NT. The biaxial strain and stress are also strongly affected by the non-uniformity of the SiN_x buffer layer thickness.
机译:基于高分辨率X射线对晶格参数的精确测量,通过金属有机化学气相沉积(MOCVD)对0至660 s之间不同生长时间的氮化Si(111)衬底上的GaN膜进行了应变分析。衍射(HR-XRD)。在固定的生长条件下改变氮化时间(NT)。测量a和c晶格参数,然后测量面内和面外应变。然后,从获得的总应变值中提取出双轴和静水分量,然后在本研究中将其作为NT的函数进行讨论。 SiN_x缓冲层厚度的不均匀性也极大地影响了双轴应变和应力。

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