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首页> 外文期刊>Ferroelectrics: Letters Section >Interface Charge Trap Density of Solution Processed Ferroelectric Gate Thin Film Transistor Using ITO/PZT/Pt Structure
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Interface Charge Trap Density of Solution Processed Ferroelectric Gate Thin Film Transistor Using ITO/PZT/Pt Structure

机译:使用ITO / PZT / Pt结构的固溶处理铁电栅薄膜晶体管的界面电荷陷阱密度

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摘要

The conductance method was applied to investigate the interface charge trap density (D_(it)) of solution processed ferroelectric gate thin film transistor (FGT) using indium-tin oxide (ITO)/ Pb(Zr,Ti)O_3 (PZT)/Pt structure. As a result, a large value of D_(it) of MFS capacitor, i.e., Pt/PZT/ITO, was estimated to be 1.2 × 10~(14) eV~(-1) cm~(-2). This large D_(it) means that an interface between the ITO layer and the PZT layer is imperfect and it is one of the main reasons for the poor memory property of this FGT. By using transmission electron microscopy (TEM), this imperfect interface was clearly observed. Thus, it is concluded that improvement of this interface is critical for better memory performance.
机译:应用电导法研究了铟锡氧化物(ITO)/ Pb(Zr,Ti)O_3(PZT)/ Pt固溶处理的铁电栅薄膜晶体管(FGT)的界面电荷陷阱密度(D_(it))结构体。结果,MFS电容器的D_(it)的大值,即Pt / PZT / ITO,估计为1.2×10〜(14)eV〜(-1)cm〜(-2)。较大的D_(it)意味着ITO层和PZT层之间的界面不完善,这是此FGT的较差存储特性的主要原因之一。通过使用透射电子显微镜(TEM),可以清楚地观察到这种不完善的界面。因此,可以得出结论,此接口的改进对于提高内存性能至关重要。

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