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Optimization of Pt and PZT Films for Ferroelectric-Gate Thin Film Transistors

机译:铁电门控薄膜晶体管的Pt和PZT膜的优化

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摘要

The polycrystalline Pt film with an excellent (111) orientation and a small grain size of about 30 nm was successfully prepared on a SiO_2/Si substrate by the new structured-sputtering system. By optimizing annealing process and using the highly (111)-oriented Pt film as a bottom electrode, an epitaxial-grade (111)-oriented PZT film was suc-cessfully prepared by the sol-gel method. Operation of the ferroelectric-gate thin film transistor (FGT) with indium-tin-oxide (ITO) channel, which was based on the optimum Pt and PZT films, has been verified. The FGT device exhibited good properties and performance with high "on/off" current ratio (~10~5), adequate memory window (1.2 V) and small swing factor (~88 mV/decade).
机译:通过新的结构溅射系统成功地在SiO_2 / Si衬底上制备了具有优异(111)取向和约30 nm小晶粒尺寸的多晶Pt膜。通过优化退火工艺并使用高度(111)取向的Pt膜作为底部电极,通过溶胶-凝胶法成功制备了外延级(111)取向的PZT膜。已经验证了基于最佳Pt和PZT薄膜的具有铟锡氧化物(ITO)通道的铁电栅薄膜晶体管(FGT)的运行。 FGT器件具有良好的性能和性能,具有高的“开/关”电流比(〜10〜5),足够的存储窗口(1.2 V)和较小的摆幅系数(〜88 mV /十倍)。

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