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Shear testing of BGA pads-pads are not as good as they were?

机译:BGA垫的剪切测试不如以前好吗?

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摘要

Shear force measurement is a common and quick way of destructively assessing solder joints and complements pull strength measurements. The use of shear measurement has increased in popularity as a method of testing joints after some form of environmental testing because it is easy and quick to perform. This is particularly true during the introduction of lead-free manufacture, and it is one of the test methods of choice at National Physical Laboratory (NPL) on many of their lead-free studies.
机译:剪切力测量是一种破坏性评估焊点的常用且快速的方法,可补充拉伸强度的测量。在某种形式的环境测试之后,作为一种测试接缝的方法,剪切测量的使用已日益普及,因为它易于执行且快速。在引入无铅制造过程中尤其如此,它是国家物理实验室(NPL)在许多无铅研究中选择的测试方法之一。

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