This study investigates bonding and shear flow phenomena for nanoscale BGA (Ball Grid Array) solder joint in electronic package pads with or without intermetallic compounds (IMC). Three types of solder joints have been studied, such as Snl00%, Sn44%-Cu56% and Sn92.5%-Ag3.5%-Cu4%. The IMC layer composes of Cu_6Sn_5 and Cu_3Sn materials. The above materials are arranged according to the single crystal structure. The molecular dynamics method and the embedded atom potential are used to understand the internal micro structure, interface layer and the bonding strength differences for welded joints. The total energy of the simulated system includes the molecular potential energy, kinetic energy and electromagnetic coupling moments. An aging process at 453K for solder joint without IMC layer has been conducted to understand the aging effect.
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