To obtain an accurate BGA profile, a thermocouple must be placed in firm thermal contact with a pad or ball

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To obtain an accurate BGA profile, a thermocouple must be placed in firm thermal contact with a pad or ball

机译：为了获得准确的BGA轮廓，必须将热电偶与焊盘或焊球牢固地热接触。

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《Electronic Packaging and Production》 |1998年第11期|共2页
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1. To obtain an accurate BGA profile, a thermocouple must be placed in firm thermal contact with a pad or ball [J] . Electronic Packaging and Production Group Electronic Packaging and Production . 1998,第11期

机译：为了获得准确的BGA轮廓，必须将热电偶与焊盘或焊球牢固地热接触。
2. Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads [J] . Yi Li, Fengshun Wu, Y. C. Chan Journal of materials science . 2015,第11期

机译：具有Au / Ni / Cu焊盘的共晶In-48Sn球栅阵列（BGA）焊料互连中的电迁移
3. Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads [J] . Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara Materials transactions . 2001,第5期

机译：无铅焊锡球中的铜对带有金/镍涂层铜垫的BGA接头组织的影响
4. BOARD-LEVEL THERMAL CYCLING AND MECHANICAL BEND RELIABILITY OF HiCTE FLIP-CHIP BGAS WITH MULTIPLE BGA PAD SURFACE FINISHES [C] . Rajiv Dunne, Kejun Zeng, Sergio Martinez, The Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging . 2006

机译：具有多个BGA焊盘表面的Hicte倒装芯片BGA的板级热循环和机械弯曲可靠性
5. Study on thermally reworkable underfills for flip chip, BGA, and CSP applications. [D] . Wang, Lejun. 2001

机译：研究用于倒装芯片，BGA和CSP应用的可热修复的底部填充胶。
6. Effects of AlN and BCN Thin Film Multilayer Design on the Reaction Time of Ni/Ni-20Cr Thin Film Thermocouples on Thermally Sprayed Al2O3 [O] . Wolfgang Tillmann, David Kokalj, Dominic Stangier, 2019

机译：AlN和BCN薄膜多层设计对Ni / Ni-20Cr薄膜热电偶在热喷涂Al2O3上反应时间的影响
7. Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint Using Electroless Plated Ni/Au Pad. [O] . Toshio SAEKI, Shinya KIYONO, Keisuke UENISHI, 2001

机译：Cu Cureed Ball在焊球中的影响与无电镀Ni / Au垫BGA关节组织和强度的影响。

To obtain an accurate BGA profile, a thermocouple must be placed in firm thermal contact with a pad or ball

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