Pad Wear Analysis during Interlayer Dielectric Chemical Mechanical Planarization

摘要

In this study, pad wear during interlayer dielectric (ILD) chemical mechanical planarization (CMP) was investigated using retaining rings with different materials and slot designs as well as pads with different materials at different platen temperatures. Results showed that the retaining ring slot design did not significantly affect the pad wear rate. On the other hand, the polyether ether ketone (PEEK) retaining ring exhibited a significantly lower pad wear rate (by 31%) than the polyphenylene sulfide (PPS) retaining ring. At both platen temperatures (25 and 50°C), the thermoplastic D100 pad exhibited lower pad wear rates than the thermoset IC1000 pad.