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Direct fabrication of BiFeO3 thin films on polyimide substrates for flexible electronics

机译:直接制造BIFEO3薄膜在柔性电子器件中的聚酰亚胺基材上

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One of the major challenges for the integration of functional oxides as ferroelectrics into flexible electronics is the reduction of their processing temperature below that which causes the degradation of plastic substrates. With this aim, particular attention has been given to the low-temperature processing of oxide films by chemical solution deposition methods. In this work, lead-free multifunctional and multiferroic BiFeO3 (BFO) thin films were fabricated for the first time at a temperature as low as 300 degrees C directly on flexible polyimide substrates by our own proprietary solution-based Seeded Photosensitive Precursor Method. Despite this exceptionally low thermal budget, a remanent polarization, P-r, of 2.8 mu C cm(-2) was obtained for these BFO films, with a coercive field, E-c, of 380 kV cm(-1). In addition, and of significant relevance, the films exhibited a room temperature ferromagnetic response, showing for the first time the multiferroic behaviour at room temperature of BFO films prepared at 300 degrees C. The ferroelectric, piezoelectric and ferromagnetic functionalities demonstrated for these films revealed their potential for applications in microelectronic devices as well as their feasibility for being used in flexible electronics. The results shown here are a proof of concept of the Seeded Photosensitive Precursor Method for the successful integration of lead-free ferroelectric thin films with flexible plastic substrates and have a broad impact in terms of the extended use of functional oxide thin films processed with low thermal schedules.
机译:将功能氧化物作为铁电解成柔性电子器件的主要挑战之一是其处理温度降低,低于塑料基材的降解。通过这种目的,通过化学溶液沉积方法对氧化膜的低温处理进行了特别的注意。在这项工作中,通过我们自己的基于溶液的种子光敏前体方法,在柔性聚酰亚胺基材上首次在低至300℃的温度下,在柔性聚酰亚胺基材上首次制造无铅多功能和多配子BifeO3(BFO)薄膜。尽管具有以下热预算,但对于这些BFO薄膜,可以获得剩余的偏振,P-R为2.8μcccm(-2),其中矫顽磁场,E-C为380kVcm(-1)。此外,具有显着的相关性,薄膜表现出室温铁磁反应,首次表示在300摄氏度下制备的BFO膜室温下的多体性行为。对于这些薄膜的铁电,压电和铁磁性官能团显示出来的微电子器件应用的潜力以及它们在柔性电子器件中使用的可行性。这里所示的结果是用于成功集成具有柔性塑料基材的无铅铁电薄膜的种子光敏前体方法的概念证据,并且在用低热加工的功能氧化物薄膜的延长使用方面具有广泛的影响时间表。

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