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机译:高电流密度应力下Ni涂层石墨烯掺杂SAC305无铅复合焊料的可靠性研究
Zhejiang Univ Ningbo Inst Technol Sch Mech &
Energy Engn Ningbo Zhejiang Peoples R China;
Zhejiang Univ Ningbo Inst Technol Sch Mech &
Energy Engn Ningbo Zhejiang Peoples R China;
Zhejiang Huashuo Technol Co LTD Ningbo Zhejiang Peoples R China;
Zhejiang Univ Ningbo Inst Technol Sch Mech &
Energy Engn Ningbo Zhejiang Peoples R China;
Huazhong Univ Sci &
Technol State Key Lab Mat Proc &
Die &
Mould Technol Dalian Peoples R China;
Lead-free solder; Electro-migration; Microstructures; Mechanical properties;
机译:高电流密度应力下Ni涂层石墨烯掺杂SAC305无铅复合焊料的可靠性研究
机译:基于SAC305和掺杂囊焊料的蠕变应变能密度的焊点可靠性
机译:用于高温应用的无铅焊料(SAC305和Sn3.5Ag)的热循环可靠性
机译:镀镍石墨烯对SAC305焊料性能的影响
机译:用于高温应用的无铅焊料(SAC305和锡(3.5)银)的热循环可靠性
机译:3D通过SAC305焊料合金的聚结行为在环氧复合材料中互连氮化硼网络作为增强导热率的桥接材料
机译:无铅复合粉末焊锡膏的制备及无铅焊点可靠性研究