In this paper, a three-dimensional shape prediction model and a finite element solution procedure for flip-chip and BGA solder joints are developed. The developed system is capable of calculating the solder joint geometry and the fatigue lifeautomatically without any intervention from the user. The automation achieved will enable fast reliability estimation and improved accuracy, since the two-dimensional finite element mesh used for solder shape prediction is used to generate thethree-dimensional finite element mesh for stress analysis. The implementation of the procedure is verified using the solution for a flip-chip joint from literature, and the capability of the code is demonstrated on a hypothetical three-dimensional solderjoint with square pads that are rotated with respect to each other, and offset from each other. The system developed in the study represents the first instance of an integrated, automated finite element procedure for both shape and fatigue life prediction in general three-dimensional solder joints. The automation achieved in the system enables fast reliability estimation in a design environment, and the optimal design of flip-chip and BGA solder joint configurations for maximum life.
展开▼
