LIFE PREDICTION MEANS FOR SOLDER JOINT, AND LIFE PREDICTION METHOD FOR SOLDER JOINT

摘要

A control device (10) comprising this life prediction means of a solder joint comprises: a temperature sensor (3) that measures the temperature of a solder joint of an electronic circuit board that drives a heater (7) and a motor (9); a storage unit (51) that stores a reference acceleration coefficient that is an acceleration coefficient based on test conditions of a thermal shock test of electrical equipment in which the electronic circuit board is mounted, and reference conditions for the use environment of the electrical equipment; a calculation unit (52) that calculates the actual acceleration coefficient from the temperature change width of the solder joint during one cycle from start to end of driving of the heater (7) or the motor (9) and the maximum temperature reached, integrates the acceleration coefficient ratio for which the actual acceleration coefficient is divided by the reference acceleration coefficient for each cycle from start to end of driving of a load, and finds the integrated value of the acceleration coefficient ratio; and a judgment unit (53) that compares the integrated value of the acceleration coefficient ratio with a threshold value and predicts the life of the solder joint.