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Influence of ion-rich plasma discharge channel on unusually high discharging points in reverse micro electrical discharge machining

机译:离子富含等离子体放电通道对反向微电路放电加工异常高放电点的影响

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摘要

Different discharges occurring during machining in micro electrical discharge machining (MEDM) and its variants, viz. reverse MEDM (RMEDM) and wire EDM, affect the shape, size, surface roughness, and surface integrity of the generated surface. Of these different discharges, there are certain discharges with unusually high discharging points (well above open circuit voltage) during machining that have not been analysed till date. This study primarily aims in understanding the physical phenomenon behind occurrences of these unusual discharges specific to RMEDM process. This understanding should also hold good for MEDM and other electric discharge-based machining processes. A numerical model was developed taking into account the movement of ions and electrons in the dielectric during machining. The model predicted that the presence of ions only in the plasma discharge channel for a very short period of time during machining leads to occurrences of these unusually high discharging points (~170% of open circuit voltage, OCV) which was also verified from experiments (162-164% of OCV).
机译:在微放电加工(MEDM)和它的变体,即在加工过程中发生的不同的放电。反向MEDM(RMEDM)和线EDM,影响所产生的表面的形状,尺寸,表面粗糙度,和表面的完整性。这些不同的放电的,有与没有被分析,直到日期加工时不寻常的高放电点(远高于开路电压)某些放电。这项研究的主要目的在了解这些异常放电具体到RMEDM过程的出现背后的物理现象。这种理解也应把握好对MEDM及其他电子基于放电加工工艺。数值模型的开发在加工过程中要考虑到在介电的离子和电子的移动。该模型预测,只有在一段很短的时间的等离子放电通道的离子的加工导致这些不寻常的高放电点的出现(〜开路电压,OCV的170%),其还从实验验证(在存在OCV的162-164%)。

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