机译:一种新型表面抛光方法及其在晶圆超细抛光中的基本性能
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Beijing Jiaotong Univ Sch Mech Elect &
Control Engn Beijing 100044 Peoples R China;
Magnetorheological finishing; Polishing; Wafer; Porous foam; Smooth roughness; Flatness; Nano-level surface; Material removal process;
机译:一种新型表面抛光方法及其在晶圆超细抛光中的基本性能
机译:磁性化合物流体抛光液在金属表面非接触抛光中的基本性能
机译:分析不同抛光垫轮廓的化学机械平坦化抛光晶片的有效抛光频率和次数的方法
机译:加工参数对凝胶耦合超细磨料抛光片抛光硅片的影响
机译:半导体晶片的化学机械抛光:预测晶片表面形状的表面元素建模和仿真
机译:超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
机译:用磁流体(FFF)研究GLp(研磨抛光):si晶片的表面抛光特性