WAFER END SURFACE POLISHING PAD, WAFER END SURFACE POLISHING APPARATUS, AND WAFER END SURFACE POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wafer end surface polishing pad capable of suppressing scattering of slurry and reducing LPD on the rear surface of a wafer after polishing of an end surface.SOLUTION: The wafer end surface polishing pad is a pad for polishing an end surface of a wafer. A main surface composed of a front surface and a back surface has a substantially rectangular shape. A plurality of grooves opened at both ends in a lateral direction of the pad are arranged along a short direction of the pad with a space in a longitudinal direction of the pad.SELECTED DRAWING: Figure 1