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首页> 外文期刊>ACS applied materials & interfaces >Rational Hydrogenation for Enhanced Mobility and High Reliability on ZnO-based Thin Film Transistors: From Simulation to Experiment
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Rational Hydrogenation for Enhanced Mobility and High Reliability on ZnO-based Thin Film Transistors: From Simulation to Experiment

机译:合理加氢以增强ZnO基薄膜晶体管的迁移率和高可靠性:从仿真到实验

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Hydrogenation is one of the effective methods for improving the performance of ZnO thin film transistors (TFTs), which originate from the fact that hydrogen (H) acts as a defect passivator and a shallow n-type dopant in ZnO materials. However, passivation accompanied by an excessive H doping of the channel region of a ZnO TFT is undesirable because high carrier density leads to negative threshold voltages. Herein, we report that Mg/H codoping could overcome the trade-off between performance and reliability in the ZnO TFTs. The theoretical calculation suggests that the incorporation of Mg in hydrogenated ZnO decrease the formation energy of interstitial H and increase formation energy of O-vacancy (V-O). The experimental results demonstrate that the existence of the diluted Mg in hydrogenated ZnO TFTs could be sufficient to boost up mobility from 10 to 32.2 cm(2)/(V s) at a low carrier density (similar to 2.0 x 10(18) cm(-3)), which can be attributed to the decreased electron effective mass by surface band bending. The all results verified that the Mg/H codoping can significantly passivate the V-O to improve device reliability and enhance mobility. Thus, this finding clearly points the way to realize high-performance metal oxide TFTs for low-cost, large-volume, flexible electronics.
机译:氢化是提高ZnO薄膜晶体管(TFT)性能的有效方法之一,这源于氢(H)充当ZnO材料中的缺陷钝化剂和浅n型掺杂剂的事实。然而,钝化伴随着ZnO TFT的沟道区域的过量H掺杂是不期望的,因为高载流子密度导致负阈值电压。在本文中,我们报道Mg / H共掺杂可以克服ZnO TFT中性能和可靠性之间的折衷。理论计算表明,在氢化ZnO中掺入Mg会降低间隙H的形成能并增加O空位(V-O)的形成能。实验结果表明,在低载流子密度(类似于2.0 x 10(18)cm)下,氢化ZnO TFT中存在的稀释Mg足以将迁移率从10提高到32.2 cm(2)/(V s)。 (-3)),这可以归因于表面带弯曲导致电子有效质量降低。所有结果都证明,Mg / H共掺杂可以使V-O显着钝化,从而提高器件可靠性并提高迁移率。因此,这一发现清楚地指出了为低成本,大批量,柔性电子产品实现高性能金属氧化物TFT的方法。

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