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Characterization and depth profiles measurements of silicon nitride thin films on silicon and molybdenum substrates by Auger electron spectroscopy

机译:俄歇电子能谱法表征硅和钼衬底上氮化硅薄膜的特性和深度分布

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Silicon nitride thin films were deposited on Si or Mo substrates using a technique of plasma enhanced chemical vapor deposition (PECVD). Depth profiles measurements were carried out on these Si3N4 layers, as well as on the Si3N4/Mo and Si3N4/Si interlayer by Auger electron spectroscopy, associated with Argon ion sputtering. For the Si3N4 films deposited on Mo substrates a sequence of three distinguishable zones were observed: the Si3N4 layer; an interlayer containing Si-N, Mo-N, and presumably Mo-Si bonds, a diffusion zone of nitrogen into the Mo substrate. On the Si substrate a more usual depth profile was evidenced involving the sequence of the Si3N4 layer, an interlayer zone with the presence of Si-N and Si-Si bonds, and finally the Si substrate. (c) 2004 Elsevier B.V. All rights reserved.
机译:使用等离子增强化学气相沉积(PECVD)技术将氮化硅薄膜沉积在Si或Mo衬底上。通过与氩离子溅射有关的俄歇电子能谱对这些Si3N4层以及Si3N4 / Mo和Si3N4 / Si中间层进行了深度分布测量。对于沉积在Mo衬底上的Si3N4膜,观察到三个可区分区域的序列:Si3N4层;包含Si-N,Mo-N和大概是Mo-Si键的中间层,是氮在Mo衬底中的扩散区。在Si衬底上,更常见的深度分布被证明涉及Si 3 N 4层的序列,存在Si-N和Si-Si键的夹层区以及最后是Si衬底。 (c)2004 Elsevier B.V.保留所有权利。

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