金めっき浴中における銅不純物の電解除去による管理技術

摘要

There are so-called wire bonding methods to electrically connect semiconductor IC chips and printedwiring boards. Typically, gold plating is applied to the connection terminal pad on the wiring board, andthe higher the purity of the plated gold film, the higher the connection strength of the wire and the betterthe long term reliability. But in the process of manufacturing printed wiring boards, it is impossible tocompletely avoid impurities in the plating bath. In this study, we removed impurities in the gold platingbath using constant potential electrolysis at several different electrode potentials, and we discuss theperformance of this technique for the removal of impurities in the gold plating bath.