Electrostatically Actuated Micromirror Array Assembled by Using Solder Flip Chip Bonding and Electro-Thermal Fuse-Away Tethers

摘要

We propose a new electrostatically-actuated micromirror array. Using solder flip chip bonding technology, the desired electrode gap and the mirror rotation range can be easily created and enlarged. The use of solder assembly technology also provides us not only design flexibility but also precise gap height and mirror position control. In the mirror assembly process, a new MEMS transfer method using temporary fuse-away tethers is used to achieve robust and clean batch assembly. The mirror array is designed through FEM analysis and design optimization using a surface response method. The driving power of the optimized mirror system is reduced to one-third that of the initial design. The testing results of the fabricated mirror device show consistency with the predicted mirror performance and assembly precision.