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首页> 外文期刊>電子情報通信学会技術研究報告. 電子部品·材料. Component Parts and Materials >Low temperature epitaxial growth of 3C-SiC by triode plasma CVD using dimethylsilane and hydrogen
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Low temperature epitaxial growth of 3C-SiC by triode plasma CVD using dimethylsilane and hydrogen

机译:使用二甲基硅烷和氢气的三极管等离子体CVD低温外延生长3C-SiC

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摘要

The cubic-silicon carbide (3C-SiC) were grown at low temperatures on Si substrates by triode plasma CVD. By the high density hydrogen radicals generated by rf plasma, epitaxial growth at 900℃ was realized, while the growth by low pressure CVD was realized at higher than 950℃. The activation energy of epitaxial growth rate was 48kcal/mol, which was about 25kcal/mol smaller than that of low pressure CVD.
机译:通过三极等离子体CVD,在硅衬底上于低温下生长立方碳化硅(3C-SiC)。通过射频等离子体产生的高密度氢自由基,实现了900℃的外延生长,而高于950℃的低压CVD的生长。外延生长速率的活化能为48kcal / mol,比低压CVD小约25kcal / mol。

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