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Impact of GaN transition layers in the growth of GaN epitaxial layer on silicon

机译:GaN过渡层对硅上GaN外延层生长的影响

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摘要

A method for growing GaN epitaxial layer on Si (111) substrate is investigated. Due to the large lattice mismatch between GaN and AlN, GaN grown directly above an AlN buffer layer on the Si substrate turns out to be of poor quality. In this study, a GaN transition layer is grown additionally on the AlN buffer before the GaN epitaxial growth. By changing the growth conditions of the GaN transition layer, we can control the growth and merging of islands and control the transfer time from 3D to 2D growth mode. With this method, the crystalline quality of the GaN epitaxial layer can be improved and the crack density is reduced. Here, we have investigated the impact of a transition layer on the crystalline quality and stress evolution of a GaN epitaxial layer with methods of X-ray diffraction, optical microscopy and in situ reflectivity trace. With the increasing thickness of transition layer, the crack decreases and the crystalline quality is improved. But when the transition layer exceeds a critical thickness, the crystalline quality of the epilayer becomes lower and the crack density increases.
机译:研究了一种在Si(111)衬底上生长GaN外延层的方法。由于GaN和AlN之间的大的晶格失配,直接在Si衬底上的AlN缓冲层上方生长的GaN质量差。在这项研究中,在GaN外延生长之前,在AlN缓冲层上额外生长了GaN过渡层。通过更改GaN过渡层的生长条件,我们可以控制岛的生长和合并,并控制从3D到2D生长模式的转移时间。利用这种方法,可以提高GaN外延层的晶体质量并且降低裂纹密度。在这里,我们使用X射线衍射,光学显微镜和原位反射率法研究了过渡层对GaN外延层的晶体质量和应力演化的影响。随着过渡层厚度的增加,裂纹减少,晶体质量提高。但是,当过渡层超过临界厚度时,外延层的晶体质量变低,裂纹密度增加。

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