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Probing charge carrier compensation in high energy ion irradiated III-V semiconductor by Raman spectroscopy and Hall measurements

机译:通过拉曼光谱和霍尔测量探测高能离子辐照的III-V半导体中的载流子补偿

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摘要

Raman spectroscopy and Hall measurements have been carried out to investigate the differences in near-surface charge carrier modulation in high energy (similar to 100MeV) silicon ion (Si8+) and oxygen ion (O7+) irradiated n-GaAs. In the case of O ion irradiation, the observed decrease in carrier concentration with increase in ion fluence could be explained in the view of charge compensation by possible point defect trap centers, which can form because of elastic collisions of high energy ions with the target nuclei. In Si irradiated n-GaAs one would expect the carrier compensation to occur at a fluence of 2.5x10(13) ions/cm(2), if the same mechanism of acceptor state formation, as in case of O irradiation, is considered. However, we observe the charge compensation in this system at a fluence of 5x10(12) ions/cm(2). We discuss the role of the complex defect states, which are formed because of the interaction of the primary point defects, in determining carrier concentration in a Si irradiated n-GaAs wafer. The above results are combined with the reported data from the literature for high energy silver ion irradiated n-GaAs, in order to illustrate the effect of both electronic and nuclear energy loss on trap creation and charge compensation. Copyright (c) 2016 John Wiley & Sons, Ltd.
机译:已经进行了拉曼光谱和霍尔测量,以研究在高能(类似于100MeV)硅离子(Si8 +)和氧离子(O7 +)辐照的n-GaAs中近表面电荷载流子调制的差异。在O离子辐照的情况下,观察到的载流子浓度随离子通量的增加而降低,可以通过可能的点缺陷陷阱中心进行电荷补偿来解释,这可能是由于高能离子与目标原子核的弹性碰撞而形成的。 。如果考虑与O辐照相同的受主态形成机理,则可以预期在Si辐照的n-GaAs中,载流子补偿将以2.5x10(13)离子/ cm(2)的通量发生。但是,我们在该系统中观察到电荷补偿为5x10(12)离子/ cm(2)。我们讨论由于主要点缺陷的相互作用而形成的复杂缺陷状态在确定被Si照射的n-GaAs晶片中载流子浓度中的作用。将以上结果与高能银离子辐照n-GaAs的文献报道数据相结合,以说明电子和核能损失对陷阱形成和电荷补偿的影响。版权所有(c)2016 John Wiley&Sons,Ltd.

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